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当前位置: 艾媒报告中心 > 战略新兴产业 > 5G/芯片

本报告研究涉及企业/品牌/案例:华为,小米,vivo,OPPO,中国移动,中国联通,中国电信,苹果,诺基亚,魅族,三星,一加,红米,荣耀,高通,联发科,紫光展锐,英特尔,Broadcom,Skyworks,Qorvo,Murate,LG,三洋,宁德时代,比亚迪,NanoGraf,京东方,深天马A,华星光电

随着智能手机的不断普及,4G市场饱和趋势已经显现,5G商用的落地将带动5G手机发展,为手机产业带来新的活力。iiMedia Research(艾媒咨询)数据显示,预计2020-2023年将会出现5G手机的换机潮,2023年全球5G智能手机出货量将会增至40130万台。目前,华为、VO、小米等中国手机品牌都已经参与了5G市场争夺战。并且,5G手机将进一步带动产业链上下游发展,上游的元器件制造商、中游的通信设备商和下游的终端厂商都将收益,预计2025年5G相关产品和服务市场规模将达到1.15万亿元。艾媒咨询分析师认为,在政策利好、经济繁荣、技术发展和社会需求扩大的背景下,5G手机行业将会加速发展,具备较强技术实力和经济实力的玩家有望成为赛道领跑者,行业头部效应逐渐凸显。

With the continuous popularization of smart phones, the saturation trend of 4G market has emerged. The landing of 5G commercial will drive the development of 5G mobile phones and bring new vitality to the mobile phone industry. IiMedia Research (AI Media Consulting) data show that it is expected that there will be a change of 5G mobile phones in 2020-2023, and the global shipment of 5G smart phones will increase to 401.3 million units in 2023. At present, Huawei, VO, Xiaomi and other Chinese mobile phone brands have all taken part in the 5G market battle. In addition, 5G mobile phones will further drive the development of the upstream and downstream of the industrial chain. The upstream component manufacturers, the middle-stream communication equipment manufacturers and the downstream terminal manufacturers will all benefit. It is estimated that the market size of 5G related products and services will reach 1.15 trillion yuan in 2025. Ai Mei's consulting analysts believe that under the background of favorable policies, economic prosperity, technological development and expanding social demand, the 5G mobile phone industry will accelerate its development. Players with strong technological and economic strength are expected to become track leaders and the head effect of the industry will gradually become prominent.

本报告研究涉及企业/品牌包括:和舰芯片、联华电子、厦门联芯、富拉凯咨询、橡木联合、台积电、中芯国际、三星、格罗方德

集成电路为信息产业的基础。中国虽为全球最大半导体市场,但国产率低,核心芯片极度缺乏。根据 IC Insights 统计资料,2018年中国集成电路自给率仅为15.35%。中国政府给予集成电路行业大力的政策支持及税收减免。2016-2018年和舰芯片收到共计52亿元的政府补助,2019年成为首家成功受理的台资晶圆代工企业。然而,芯片制造属于典型的资金密集型行业,和舰芯片在过去三年主要投入28nm工艺集成电路生产线的研发生产,投资额约50亿美元,目前仍处于亏损状态。根据艾媒咨询测算,和舰芯片主要固定资产和专有技术使用权成新率在60%以上,未来3年内的折旧摊销将依然巨大,难以盈利。且受限台湾半导体政策,和舰芯片技术落后台湾母公司一代,落后台积电两代,更将面临28nm制程激烈的市场竞争。

Integrated circuits are the foundation of the information industry. Although China is the world's largest semiconductor market, the country's productivity is low and core chips are extremely scarce. According to IC Insights statistics, China's IC self-sufficiency rate was only 15.35% in 2018. The Chinese government has given strong policy support and tax relief to the IC industry. In 2016-2018, HeJian received a total of 5.2 billion yuan in government subsidies. In 2019, HeJian became the first Taiwan-funded foundry company to be successfully accepted by the science and technology innovation board. However, chip manufacturing is a typical capital-intensive industry. In the past three years, HeJian has mainly invested in the research and development of 28nm process integrated circuit production lines, with an investment of about 5 billion US dollars, and is still in a deficit state. According to iiMedia Research, the newness rate of the main fixed assets and proprietary technology of HeJian is above 60%. Depreciation and amortization will remain huge in the next three years, making it difficult to make a profit. And limited by Taiwan's semiconductor policy, HeJian’s technology lags behind Taiwan's parent company by one generation and TSMC by two generations.


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