关于“集成电路行业”的报告
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艾媒咨询|2021年9-10月中国先进制造行业投融资数据分析简报
伴随新一轮科技革命的开展，新兴信息技术与制造业进行了深度融合，先进制造业成为经济发展的新引擎。近年来，先进制造产业创新不断涌现，并发展成为最活跃的行业之一，相关细分赛道也维持着较高的增长，收获了资本的大量关注。艾媒咨询通过艾媒数据中心(data.iimedia.cn)查询并发布《2021年9-10月中国先进制造行业投融资数据分析简报》，助力投资人与创业者用户即时了解市场趋势，获取关键投资决策所需的数据，把握投资逻辑和最新产业机会。
iiMedia Research inquires and publishes the“Analysis report on investment and financing data of China's advanced manufacturing industry from September to October 2021” through iimedia data center (data. iimedia. cn), so as to help investors and entrepreneurs understand the market trend in real time, obtain the data required for key investment decisions, and grasp the investment logic and the latest industrial opportunities. -
艾媒咨询|2020上半年中国人工智能芯片行业研究报告
本报告研究涉及企业/品牌/案例：寒武纪、知存科技。
iiMedia Research(艾媒咨询)数据显示，2019年中国AI芯片市场规模约为115.5亿元，在5G商用的普及和政策、技术等各因素的推动下，AI芯片有望在云计算、安防、消费电子、机器人等领域实现大规模商用，预计2021年AI芯片市场规模将达到436.8亿元。但值得注意的是，随着人工智能技术的加速普及，下游应用领域对AI算力和能耗的要求越来越高，传统冯诺依曼架构式芯片的瓶颈逐渐显露，AI芯片将朝着存算一体化方向发展。艾媒咨询分析师认为，存算一体AI芯片的发展前景虽受到广泛认可，但整体仍处在发展的起步阶段。从实现计算与存储的融合设计，到技术的落地、量产、规模化商用，还有较长阶段。能够率先实现技术、产品突破的企业将更容易获得资本、人才、市场的支持。
According to data from iiMedia Research, the scale of China’s AI chip market in 2019 is about 11.55 billion yuan. Driven by the popularization of 5G commercial use, policies, and technology, AI chips are expected to be used in cloud computing, security, and consumer electronics. Robotics and other fields achieve large-scale commercial use, and the AI chip market is expected to reach 43.68 billion yuan in 2021. However, with the accelerated popularization of artificial intelligence technology, downstream application fields have higher and higher requirements for AI computing power and energy consumption. The bottleneck of traditional Von Neumann architecture chips has gradually emerged, and AI chip will develop towards the integration of storage and computing. iiMedia Consulting analysts believe that although the development prospects of the storage-computing integrated AI chip are widely recognized, the overall development is still in the initial stage. From the realization of the integrated design of computing and storage, to the implementation of technology, mass production, and large-scale commercial use, there is still a long stage. Companies that can take the lead in achieving technological and product breakthroughs will be more easily supported by capital, talent, and the market. -
2016-2020集成电路产业全球市场态势与中国发展机遇分析预判报告
本报告涉及企业/品牌包括：杭州士兰微电子股份有限公司，立锜科技，华大半导体，晶丰明源，TRINAMIC，ROHM（罗姆），Fuji Electric（富士电机），三垦电气株式会社，飞利浦，美国NS，SGS-THOMSON意法微电子公司，深圳富满电子集团股份有限公司，深圳市茂捷半导体有限公司，圣邦微电子（北京）股份有限公司，无锡华润矽科微电子有限公司，美国国家半导体公司，恩智浦半导体公司， Maxim Integrated (MAXIM,美信)，美国无线电公司，富满电子集团股份有限公司，深圳市英锐芯电子科技有限公司，苏州坤元微电子有限公司，圣邦微电子股份有限公司，美国德州仪器公司，意法半导体公司（ST Microelectronics），安森美半导体(ON Semiconductor)，亚德诺半导体公司（Analog Devices），北京时代民芯科技有限公司，苏州云芯微电子科技有限公司，润石科技，上海贝岭股份有限公司，微芯科技（Microchip Technology Incorporated），亚德诺半导体技术有限公司（ADI），思佳讯（Skyworks），成都振芯科技股份有限公司，芯海科技（深圳）股份有限公司，中科芯集成电路股份有限公司，国民技术股份有限公司，北京君正集成电路股份有限公司，赛灵思（Xilinx），ESS Technology, Inc.，旭化成微电子株式会社（AKM, Inc.）
2018年，全球半导体产业呈良好发展趋向。数据显示，2018年全球集成电路市场全年总销售额约4784亿美元，同比增速超过10%。此外，近年来，中国电子工业持续高速增长，集成电路产业进入快速发展期。2018年，中国大陆市场销售额达1584亿美元，同比增长20%，中国市场已成为全球集成电路市场增长的主要推动力之一。在各方利好推动下，中国集成电路龙头企业的业绩近年来正持续向好。此外，新兴技术也将成为集成电路产业的未来核心产品，而核心技术及人才资源成为集成电路产业的可持续发展力。
In 2018, the global semiconductor industry is showing a good trend of development. Data show that the global integrated circuit market sales in 2018 totaled about 478.4 billion US dollars, an increase of more than 10% year-on-year. In addition, in recent years, China's electronic industry continues to grow at a high speed, and the integrated circuit industry has entered a period of rapid development. In 2018, sales in the mainland China market reached 158.4 billion US dollars, up 20% year on year. The Chinese market has become one of the main driving forces for the growth of the global integrated circuit market. Promoted by all parties, the performance of China's leading IC companies has been improving in recent years. In addition, emerging technologies will become the future core products of the integrated circuit industry, and core technologies and human resources will become the sustainable development of the integrated circuit industry. -
艾媒报告 |2019全球ETC行业现状与中国产业链商业布局研究报告
本报告研究涉及企业/品牌/案例：金溢科技，距离科技，万集科技，博通集成，E-ZPass, I-Pass, Fastrak, E-Pass, SunPass，工商银行，建设银行，农业银行，中国银行，交通银行，邮政储蓄，银联云闪付，支付宝，微信，中远海科，达华智能，星帅尔，数字政通，华铭智能，华信新材，楚天高速，环球网，新财富，时代周报
随着中国汽车保有量逐渐增多，高速、城市道路拥堵以及尾气污染等问题愈发明显，政府部门推进ETC产业落地。葡萄牙、日本等发达国家ETC系统起步较早，目前处于平稳期，而中国ETC产业则相对处于快速发展阶段。2019年中国汽车保有量有望突破2.46亿，政府以2019年年底车辆ETC装载量达90%为目标。艾媒咨询分析师认为，2019年至2020年会是ETC产业的集中爆发期，届时将带动相关企业及上下游产业链发展;ETC背后潜在的优质用户以及ETC作为车联网新入口的可能，令银行、第三方支付平台等积极争夺这一用户市场;但值得注意的是，目前潜在用户仍对ETC的信息安全、便捷性等问题存在疑虑，因此需要提高这一群体的产品接受度;同时也要避免各大金融机构短期内可能诱发的不当竞争。
As car ownership has increasingly grown in China, problems, such as high-speed and urban road congestion and exhaust pollution, have become more and more apparent, and the government departments have promoted the development of ETC industry. The ETC system in developed countries, such as Portugal and Japan, started earlier and is currently in a stable period, while the Chinese ETC industry is relatively in a rapid development stage. In 2019, Chinese car ownership is expected to exceed 246 million, and the government aims to achieve 90% vehicle ETC loading by the end of 2019. iiMedia Consulting analysts believe that 2019 to 2020 will be a period for the concentrated outbreak of ETC industry in China, which will drive the development of related companies and the upstream and downstream businesses of industry chains. Due to the potential quality users behind ETC industry and ETC’s being a new entry point for the Internet of Vehicles, banks and third-party payment platforms are actively competing for this user market. However, it is worth noting that potential users still have doubts about ETC's information security and convenience, so it is necessary to improve their product acceptance. Besides, it is necessary to avoid improper competition that may be induced by the major financial institutions in the short term. -
艾媒研报|和舰芯片研究报告：巨亏前行的芯片制造标杆
本报告研究涉及企业/品牌包括：和舰芯片、联华电子、厦门联芯、富拉凯咨询、橡木联合、台积电、中芯国际、三星、格罗方德
集成电路为信息产业的基础。中国虽为全球最大半导体市场，但国产率低，核心芯片极度缺乏。根据 IC Insights 统计资料，2018年中国集成电路自给率仅为15.35%。中国政府给予集成电路行业大力的政策支持及税收减免。2016-2018年和舰芯片收到共计52亿元的政府补助，2019年成为首家成功受理的台资晶圆代工企业。然而，芯片制造属于典型的资金密集型行业，和舰芯片在过去三年主要投入28nm工艺集成电路生产线的研发生产，投资额约50亿美元，目前仍处于亏损状态。根据艾媒咨询测算，和舰芯片主要固定资产和专有技术使用权成新率在60%以上，未来3年内的折旧摊销将依然巨大，难以盈利。且受限台湾半导体政策，和舰芯片技术落后台湾母公司一代，落后台积电两代，更将面临28nm制程激烈的市场竞争。
Integrated circuits are the foundation of the information industry. Although China is the world's largest semiconductor market, the country's productivity is low and core chips are extremely scarce. According to IC Insights statistics, China's IC self-sufficiency rate was only 15.35% in 2018. The Chinese government has given strong policy support and tax relief to the IC industry. In 2016-2018, HeJian received a total of 5.2 billion yuan in government subsidies. In 2019, HeJian became the first Taiwan-funded foundry company to be successfully accepted by the science and technology innovation board. However, chip manufacturing is a typical capital-intensive industry. In the past three years, HeJian has mainly invested in the research and development of 28nm process integrated circuit production lines, with an investment of about 5 billion US dollars, and is still in a deficit state. According to iiMedia Research, the newness rate of the main fixed assets and proprietary technology of HeJian is above 60%. Depreciation and amortization will remain huge in the next three years, making it difficult to make a profit. And limited by Taiwan's semiconductor policy, HeJian’s technology lags behind Taiwan's parent company by one generation and TSMC by two generations. -
艾媒研报 |中国5G产业及5G概念股研究报告
5G作为中国的重点发展战略，预计到2025年中国5G资本支出将达到1.5万亿元(约合2230亿美元)，有望带动国家直接经济产出6.3万亿元。总体而言，5G产业链由规划设计、基础设施建设、网络运营、产品及终端应用四大环节组成，无线主设备及传输设备这两部分占据通信网络产业链的大部分价值量。5G概念重要代表企业有中兴通讯(000063.SZ)、亨通光电(600487.SH)等。
China's 5G construction is in the leading position in the world. In the distribution of 5G industrial chain, wireless main equipment and transmission equipment occupy most of the value of the industrial chain. However, the threshold of network planning and design is high, and private design institutes need to be upgraded. In terms of wireless main equipment, antennas and PCBs are rising in volume and price, and the demand for small base stations is exploding. At the same time, 5G construction will continue to benefit transmission network equipment.
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